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Silicone thermal pad

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Product introduction:
This series of products uses silica gel as the base material and combines other auxiliary materials through a special process. It is micro-adhesive, soft, and has high thermal conductivity. It is used for gap filling and shock absorption between electronic components.



Product Features:

Product performance Testing method Unit 5w 6w 8w
Basic performance          
Colour Visual inspection - Color adjustable Color adjustable gray
Density ASTM-D5470 mm 0.5~8 0.5~8 0.5~8
Viscosity ASTM D792 g/cm3 2.2 2.8 3.2
Hardness-Shore ASTM D792-13 Shore C 18 25 32
Operating temperature range - -50~200℃ -50~200℃ -50~200℃
UL fire rating UL94-V0 - 94-V0 94-V0 94-V0
Thermal performance          
Thermal conductivity ASTM D5470 W/mK 5 6.1 7.9
Thermal resistance @40mil,20psi ASTM D792  ℃-in2/W 0.311 0.194 0.244
Electrical properties          
Dielectric breakdown voltage ASTM D150 KV/mm >3 >3 >3
Volume resistance ASTM D257 Ω.cm >1013 >1013 >1013


Applications:

● Semiconductor heat sink
● Communication equipment
● Graphics card
● Memory storage module
● Lighting equipment
● Desktop computer, notebook computer, network server D
● Power Supply
● LCD and plasma TV

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